Tutti
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z

Tutti

Adapter test
Aluminium core
Aluminium core circuit boards
Annular Ring
Anti Pad
AOI
Arc resistance
Aspect ratio
Assembly
Au
Autorouter
Base copper
Base material
Bevelling
BGA
Bill of Materials
Black Pad
Blind via
BOM
Bottom
Bow/twist
Breakout
Buried via
CAD
CAF resistance
CAM
Carbon
Castellated holes
CE-marking
Chemical silver
Chemical tin
Circuit diagram
Clearance
Clipping
Components
Component side
Copper
Copper adhesion
Copper balance
Copper build-up
Copper thickness
Counter sink
Courtyard
Creepage resistance
CTE
CTI
CU
Current-carrying capacity
Deburring
Delamination
Design Rules
Design Rule Check
DFA
DFM
Dielectric
Dielectric constant
Diffusion barrier
Dimension layer
DRC
Drilling
Drilling programme
Drill distance
Drill hole
E-Test
EAGLE
Edge plating
Electroless gold
Electroplating
ENIG
Epoxy resin
ESD
Etching
Eurocard
Excellon
Exposure
Extended Gerber
Feeder
Fiducials
Fine line
Fine pitch
Finished copper
Flexible printed circuit board
Flexural strength
Flying probe
Footprint
FR4
galv. Ni/Au
Gerber
GND
Gold
Ground
Ground plane
HAL
Halogen-free
HDI
Heavy copper
High frequency PCBs
High TG
Hole spacing
Immersion gold
Impedance
IMS
Inner layer
Insulation resistance
IPC
ISO 14001
ISO 9001
Kapton®
Keepout
Kitting
Lacquer and varnish
Lamination
Layer
Layout
Layout software
LDI
Lead
Lead-free
Locating holes
Microsection
Microvia
Milling
Mixed assembly
Mixed panel
Multilayer
Netlist
Nickel
Non-plated-through hole
Oblong hole
ODB++
Optical inspection
OSP
Outer layer
Package
Pad
Pad reduction
Panel
Panel frame
Peelable mask
Pertinax®
Pick & Place
PIH
Pin
Pips
Pitch
Placement/Assembly plan
Plated Through Hole
Plugged via
Polyimide
Prepreg
Press Fit Technology
Printed Circuit Board
Prototype
QFN
QFP
Rats nest
Resist
Rigid-Flex
RoHS
Routing
RTI
Schematic
Scoring
Selective soldering
Shelf life
Shielding
Sieb & Meyer
Signal integrity
Silkscreen
Silver
SMD
SMD stencil
SMT
Soldering
Solder mask
Solder mask clearance
Solder paste
Stacked vias
Stackup
Staggered vias
Stiffener
Surface finish
TARGET 3001!
Teardrop
Teflon®
Tempering
Tg
Thermal Pad
Thermal via
Thick copper
Through Hole Plating
Through Hole Via
THT
Tin stripping
Tombstone
Tooling
Tooling costs
Top
Track
Track/Gap
Track width
UL
Vapour phase
Via
Via covering
Wave soldering
Wire bonding
X-out
x-Ray
Yield
Z-axis milling